Description
BZ-506
Semi-Auto Drilling Machine
Positioning Accuracy: ≤0.015 mm
Maximum Board Thickness: 0.2-10.0 mm
Processing Objects: PCB, aluminum substrate, fiberglass board, and various other rigid board materials
Processing Size: 500mm × 600mm
Fiducial Mark Standards: Round; Ring; Cross; Split; Custom target shapes available upon prior request
Processable Hole Diameter: 1.0-5 mm
X-Y Axis Travel Range: 8 × 8 mm
Processing Speed: 0.35 sec/hole, i.e., 3200 holes/hour (Varies depending on product hole pitch and density)
Operating Environment: Chinese Windows XP, equipped with a simple one-click operation mode
Operation Method: Mouse click operation; manual loading/unloading of materials/boards.
Spindle Speed: 30,000 – 60,000 RPM
Machine Weight: 260 kg
Machine Dimensions: Length × Width × Height: 800 × 860 × 1180 mm
Air Source: 4 L / MIN
Power Supply: AC 220V-240V